Scriber/Placer/Tray Setter Scribing/Attaching/Pick-and-Place Machine

A rich lineup of products support the realization of factory automation in board manufacturing. These machines are characterized by high speed and high accuracy.
Fully provided with Yamaha's propriety technology, these machines support factory automation for manufacturing various printed circuit boards from ceramic substrate to flexible PCBs.
When individual machines are combined according to your requirements, considerable labor savings and automation are realized.

Features of Scriber/Placer/Tray Setter

Round hole punching equipment for film materials

  • Punching at high speed (12 holes/second) with high accuracy (±20 μm) realized
  • Model best suited for punching tooling holes for exposure and outline machining
  • In addition to film materials, some thick sheet products also supported
[ Image ] Tray setter: Tray arranging machine for small-sized pieces

Irregular hole/outline punching equipment using a small-sized post-less die

  • High-accuracy and low-cost irregular hole punching using a compact die
  • Both half-cutting type and die supported
  • Support of punched chip automatic collection possible (Optional)
[ Image ] PCB placer: High-accuracy in-frame arraying machine for HDI PCBs

Placer:
High-accuracy stiffener attaching machine for flexible PCBs

  • SUS stiffener attachment process automated, speed and accuracy improved
  • Simple machine structure and compact machine size
  • High-speed attaching motion using four heater heads
[ Image ] Placer: High-accuracy stiffener attaching machine for flexible PCBs

Film placer:
EMI shielding film attaching machine

  • Roll EMI shielding film punched and attached onto flexible PCB
  • Compared to manual operation, improvement and stabilization of attachment quality are possible
  • No positioning hole for attachment required and surface mounting efficiency improved
[ Image ] Film placer: EMI shielding film attaching machine

Scriber:
Automatic splitting machine for ceramic substrate

  • Fine cracks generated by a diamond rotary cutter to divide the board after baking
  • Washing process not required, and splitting after mounting parts possible
  • Machining with high accuracy possible without being affected by contraction due to a change in temperature at the time of baking
[ Image ] Scriber: Automatic splitting machine for ceramic substrate

Contact point

Inquiry by email

  • Request an estimate
  • Request a demonstration
  • Request a catalog
  • Request detailed specifications

Inquiry by phone

+81-53-467-3601